NXP PMEG6030EVP diode

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Features and benefits

Average forward current: I_F(AV) ≤ 3 A
Reverse voltage: V_R ≤ 60 V
Low forward voltage
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
High temperature T_j ≤ 175 °C
Suitable for both reflow and wave soldering
Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Reverse polarity protection
Low power consumption application

Parametrics

Type number	Package version	Package name	Size (mm)	V_R [max] (V)	I_F [max] (A)	Nr of functions	Configuration	I_R [max] (µA)	C_d [max] (pF)
PMEG6030EVP-Q	SOD128	CFP5	3.8 x 2.5 x 1	60.0	3.0	single	single	300000.0	575.0

Package

Type number	Orderable part number, (Ordering code (12NC))	Status	Marking	Package	Package information	Reflow-/Wave soldering	Packing
PMEG6030EVP-Q	PMEG6030EVP-QX (934662858115)	Active	DB	CFP5 (SOD128)	SOD128	REFLOW_BG-BD-1 WAVE_BG-BD-1	SOD128_115

Environmental information

Type number	Orderable part number	Chemical content	RoHS	RHF-indicator
PMEG6030EVP-Q	PMEG6030EVP-QX	PMEG6030EVP-Q

NXP PMEG6030EVP diode