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- NXP PMEG6030EVP...
Features and benefits
- Average forward current: IF(AV) ≤ 3 A
- Reverse voltage: VR ≤ 60 V
- Low forward voltage
- High power capability due to clip-bonding technology
- Small and flat lead SMD plastic package
- High temperature Tj ≤ 175 °C
- Suitable for both reflow and wave soldering
- Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
- Low voltage rectification
- High efficiency DC-to-DC conversion
- Switch mode power supply
- Reverse polarity protection
- Low power consumption application
Parametrics
| Type number | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | IR [max] (µA) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|
| PMEG6030EVP-Q | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 60.0 | 3.0 | single | single | 300000.0 | 575.0 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| PMEG6030EVP-Q | PMEG6030EVP-QX (934662858115) | Active | DB |  CFP5 (SOD128) | SOD128 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOD128_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| PMEG6030EVP-Q | PMEG6030EVP-QX | PMEG6030EVP-Q |  |  |
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